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Deep reactive-ion etching
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31	HIGH-ASPECT RATIO SUBMICROMETER NEEDLES FOR INTRACELLULAR APPLICATIONS C. G. J. Schabmueller, Y. Hanein, G. Holman, K. F. Böhringer University of Washington, Department of Electrical Engineering, Seattle, Washington 981 Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2002-06-13 21:08:00 Technology Chemistry Neurophysiology Deep reactive-ion etching Etching Silicon Microelectromechanical systems Black silicon 100 micrometres Microtechnology Materials science Semiconductor device fabrication
32	TIME-MULTIPLEXED-PLASMA-ETCHING OF HIGH NUMERICAL APERTURE PARABOLOIDAL MICROMIRROR ARRAYS Kerwin Wang, Karl F. Böhringer Electrical Engineering Department, University of Washington Seattle, WA[removed]Phone[removed] Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2003-07-09 02:25:14 Technology Micro-Opto-Electro-Mechanical Systems Etching Mirror Deep reactive-ion etching Plasma Microlens Dry etching Reactive-ion etching Microtechnology Materials science Semiconductor device fabrication
33	INTRACELLULAR NEURONAL RECORDING WITH FLEXIBLE MICRO-MACHINED PROBE IMPLANTS Anupama V. Govindarajan1, Tai C. Chen1, Russell C. Wyeth2, A. O. Dennis Willows2 and Karl F. Böhringer1 1 Department of Electrical Engineering Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2004-03-15 18:16:55 Neurophysiology Electrophysiology Microtechnology Semiconductor device fabrication Computational neuroscience Single-unit recording Multielectrode array Polyimide Deep reactive-ion etching Neuroscience Biology Science
34	Silicon Micro-Needles with Flexible Interconnections G. Holman1 , Y. Hanein1 , R. C. Wyeth2 , A. O. D. Willows2 , D. D. Denton1 , and K. F. Böhringer1 1 Department of Electrical Engineering, 2Department of Zoology, Univ Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2002-03-21 14:35:00 Microtechnology Technology Neurophysiology Deep reactive-ion etching Etching Microelectromechanical systems Multielectrode array Polyimide Wafer Semiconductor device fabrication Materials science Chemistry
35	A FULLY DRY SELF-ASSEMBLY PROCESS WITH PROPER IN-PLANE ORIENTATION Sangjun Park and Karl F. Böhringer Department of Electrical Engineering, University of Washington, Seattle, Washington, USA ABSTRACT A fully dry self-as Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2007-10-22 10:46:49 Technology Etching Deep reactive-ion etching Microfabrication Integrated circuit Three-dimensional integrated circuit Wafer Isotropic etching Microelectromechanical systems Semiconductor device fabrication Materials science Microtechnology
36	Sensors 2007, 7, [removed]sensors ISSN[removed] © 2007 by MDPI www.mdpi.org/sensors Add to Reading List Source URL: www.mdpi.org Language: English - Date: 2007-05-24 07:46:10 Electromagnetism Microelectromechanical systems Accelerometer Surface micromachining Piezoresistive effect Industrial etching Abrasive Deep reactive-ion etching Abrasive blasting Microtechnology Materials science Technology
37	Design and Fabrication of a Silicon-Based MEMS Rotary Engine Add to Reading List Source URL: www.me.berkeley.edu Language: English - Date: 2002-10-04 20:52:04 Technology Microelectromechanical systems Etching Deep reactive-ion etching Microfabrication Advanced Silicon Etch Photoresist Wankel engine Wafer Materials science Semiconductor device fabrication Microtechnology
38	Microsoft Word - AM172_Fang.doc Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2005-03-09 20:34:41 Chemistry Technology Nanotechnology Microelectromechanical systems Deep reactive-ion etching Etching Integrated circuit Wafer Self-assembled monolayer Materials science Semiconductor device fabrication Microtechnology
39	JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 3, JUNE[removed]Wafer-Level Packaging Based on Uniquely Orienting Self-Assembly (The DUO-SPASS Processes) Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2006-11-13 22:12:11 Technology Wafer Etching Deep reactive-ion etching Microelectromechanical systems Three-dimensional integrated circuit Thermal oxidation Photolithography LIGA Materials science Microtechnology Semiconductor device fabrication
40	INSTITUTE OF PHYSICS PUBLISHING JOURNAL OF MICROMECHANICS AND MICROENGINEERING J. Micromech. Microeng[removed]S91–S95 Add to Reading List Source URL: www.ee.washington.edu Language: English - Date: 2003-07-02 16:59:00 Technology Chemistry Deep reactive-ion etching Microelectromechanical systems Microfabrication Black silicon Etching Wafer Polyimide Materials science Semiconductor device fabrication Microtechnology